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Vacuum Reflow Oven

Vacuum Reflow Oven

The vacuum reflow oven is a continuous thermal processing system designed for high-reliability soldering and precision heating under vacuum conditions. It combines infrared heating, forced hot air circulation, and rapid vacuum capability to reduce voids and ensure stable product quality. The equipment is suitable for cleanroom environments and high-end electronic manufacturing.

Applications

Reflow soldering for electronic components

Semiconductor and IC packaging

PCB assembly and hybrid circuits

Optical and LCD module processing

High-reliability applications requiring low void rates

Technical Specifications

ParameterSpecification
Power SupplyAC380V, 3 Phase, 50Hz
Total Length6000 mm
Heating Zone Length5000 mm
Temperature Range40°C – 350°C (Typical ≤180°C)
Temperature Uniformity±3°C (excluding inlet/outlet)
Conveyor Speed0.3 – 2.0 m/min (adjustable)
Typical Speed0.8 m/min
Conveyor TypeSUS stainless steel mesh belt / PTFE belt
Belt Width1010 mm
Heating MethodMedium-wave quartz heaters
Exhaust VolumeMax. 10.0 m³/min
Exhaust PipeØ80 mm × 6
Exhaust Temperature≤150°C
Vacuum PerformanceVacuum achieved within 10 seconds
Temperature Control Accuracy±0.3% FS
Control SystemSiemens PLC + Touchscreen
Temperature Monitoring6-point recorder with USB export
Surface Temperature≤45°C (except inlet/outlet & exhaust areas)
Cleanliness LevelClass 100

Features

Vacuum Reflow Technology: Effectively reduces solder voids and improves joint reliability

High-Temperature Capability: Supports processes up to 350°C

Uniform Heating System: Top-down hot air circulation ensures consistent temperature distribution

Fast Heating Response: Medium-wave quartz heaters enable rapid heating and curing

Cleanroom Design: Fully welded stainless steel chamber minimizes particle generation

Stable Conveyor System: Roller-supported mesh belt ensures smooth, damage-free transport

Precision Temperature Control: OMRON PID controller with SSR output ensures high accuracy

Advanced Automation: Siemens PLC and touchscreen support MES integration

Real-time Monitoring: Multi-point temperature recording with USB data export

Comprehensive Safety Protection: Includes phase sequence protection, overload protection, emergency stop, and over-temperature protection

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