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Clean Oxygen-Free Oven (G-2DS)

Clean Oxygen-Free Oven (G-2DS)

The Clean Oxygen-Free Oven is specially designed for high-precision baking processes requiring clean and low-oxygen environments. It adopts hot air circulation heating and a dual-chamber structure to provide stable temperature control and uniform heating performance. The equipment is widely used in PCB, TP, LCD, electronics, and silicone industries for material aging, silver paste curing, ink drying, and other thermal processing applications.

The oven supports nitrogen purging to achieve an oxygen concentration of 100 ppm, meeting the requirements of oxidation-sensitive production processes. Customized designs are available according to different production requirements.

Applications

The Clean Oxygen-Free Oven is suitable for:

PCB baking and thermal curing

TP and LCD component processing

Electronic component aging tests

Silver paste curing

Conductive adhesive curing

Ink drying processes

Silicone material heat treatment

Oxygen-sensitive material baking applications

Technical Parameters

ParameterSpecification
ModelG-MOL-2DS
Heating MethodHot air circulation heating
Chamber StructureDual-chamber design
Internal MaterialSUS304 stainless steel
Air Duct MaterialSUS304 stainless steel
External MaterialSS41 steel plate with high-temperature coating
Insulation MaterialHigh-density insulation cotton
Insulation Thickness150 mm
Temperature Setting RangeRoom temperature – 250℃
Temperature Uniformity≤±1℃ (6-point empty chamber test)
Heating TimeApprox. 25 min from room temperature to 150℃
Airflow DirectionDouble-side horizontal air circulation
Timer Range0–9999 minutes
Oxygen Concentration≤100 ppm (with nitrogen supply)
Nitrogen Inlet PipeØ12 mm
Exhaust PortAdjustable 6 inch
Gas SourceAdjustable 6 inch
Cleanliness LevelClass 100
Inner Chamber SizeW610 × D610 × H610 mm
Power SupplyAC380V, 3 Phase, 50Hz
Power Consumption18 kW
WeightApprox. 260 kg

Features

Clean and Oxygen-Free Environment

Supports nitrogen filling to reduce oxygen concentration and prevent oxidation during baking processes.

High Temperature Uniformity

Dual-side horizontal airflow design ensures balanced airflow distribution and stable temperature performance.

Dual-Chamber Structure

The separated chamber design improves thermal efficiency and provides stable operation.

Cleanroom Compatible Design

SUS304 stainless steel inner chamber reduces contamination and particle generation.

Energy-Saving Insulation System

Six-side insulation structure with 150 mm insulation layer reduces heat loss and improves energy efficiency.

Precise Temperature Control

Digital PID temperature controller with SSR output provides accurate temperature regulation.

Stable Heating Performance

High-temperature long-shaft motor ensures reliable air circulation operation.

Safety Protection System

Equipped with over-temperature protection, motor overload protection, heating overload protection, circuit protection, and non-fuse breaker.

Flexible Nitrogen Control

Nitrogen flow can be adjusted according to different oxygen-sensitive process requirements.

Customizable Design

Chamber size, temperature range, airflow structure, and production configuration can be customized according to customer requirements.

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