Thermal Conductivity Tester (Heat Flow Method, Standard Model)
The Thermal Conductivity Tester (Heat Flow Method, Standard Model) is a laboratory instrument designed to measure thermal conductivity, thermal resistance, and interface contact thermal resistance of solid materials. It is suitable for thin thermally conductive materials, electrical insulation materials, ceramics, elastomers, and composite materials. With dedicated sample holders, the instrument can also test paste-like and powdered materials under controlled pressure conditions.
Application
The Thermal Conductivity Tester is used for thermal performance evaluation in the following areas:
Thermal conductivity and thermal resistance characterization of solid materials
Interface contact thermal resistance analysis of layered or bonded structures
Heat dissipation and insulation performance testing of electronic materials
Material thermal analysis in universities, research institutes, quality inspection agencies, and industrial laboratories
Applicable materials include thermally conductive silicone pads, greases, resins, rubber, beryllium oxide ceramics, aluminum oxide ceramics, electrical insulation sheets, and composite materials.
Standards
MIL-I-49456A Thermal and Insulating Materials for Thin Sheets, Thermally Conductive Resins, and Glass Fiber Reinforced Composites
GB 5598-85 Method for Measuring Thermal Conductivity of Beryllium Oxide Ceramics
ASTM D5470-12 Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials
Parameters
| Parameter | Specification |
|---|---|
| Sample diameter | Φ30 mm |
| Sample thickness | 0.02–20 mm |
| Hot plate temperature range | Ambient to 99.99 °C, resolution 0.01 °C |
| Cold plate temperature range | 0–99.0 °C, resolution 0.01 °C |
| Thermal conductivity range | 0.10–45 W/m·K |
| Thermal conductivity display | Up to 4 decimal places |
| Thermal resistance range | 0.05–0.000005 m²·K/W |
| Pressure measurement range | 0–1000 N |
| Displacement measurement range | 0–30.00 mm |
| Measurement accuracy | Better than ±3% |
| Test modes | Thermal resistance under pressure variation; material thermal conductivity; contact thermal resistance; aluminum-based composite thermal resistance; aging and reliability testing |
| Automation | Fully automatic, computer-controlled, data printing supported |
| Power supply | AC 220 V, 50 Hz |
Features
Fully automatic pressure loading and sample thickness measurement
Integrated computer control with real-time data acquisition and analysis
Six-point temperature gradient detection improves measurement accuracy
Supports thermal resistance measurement under variable pressure conditions
Optimized calculation models for thermal conductivity, thermal resistance, and interface contact resistance
Compatible with solid, paste, and powder samples
Stable, repeatable, and automated testing process
Accessories
Thermal conductivity tester main unit (no ice required) × 1
Test and control software with communication interface × 1
Constant temperature water bath with controller × 1
Gel and paste sample holders × 2
Control and data acquisition computer × 1
Test Procedures
Prepare the sample according to thickness and surface flatness requirements.
Place the sample between the hot and cold plates using the appropriate holder.
Set the test mode, temperature conditions, and pressure parameters via the control software.
Start the test; the system automatically applies pressure and records temperature gradients.
The software calculates thermal conductivity, thermal resistance, or interface contact resistance.
Save, print, or export test results after completion.
Maintenance Information
Keep the hot and cold plate surfaces clean and free from contamination.
Regularly inspect pressure sensors and displacement sensors for accuracy.
Verify temperature calibration periodically using standard reference materials.
Drain and maintain the constant temperature water bath according to operating guidelines.
FAQ
What is this product?
It is a laboratory instrument designed to measure thermal conductivity, thermal resistance, and contact thermal resistance of materials using the heat flow method.
What is this product used for?
It is used to evaluate heat transfer performance of materials and interfaces, particularly for insulation, heat dissipation, and electronic thermal management applications.
Why is this product important?
Accurate thermal property data is essential for material selection, product design, and reliability assessment in electronics and thermal engineering applications.
What industries is this product suitable for?
It is suitable for electronics, materials science, ceramics, insulation materials, research institutions, quality inspection laboratories, and industrial R&D centers.
What types of this product are available?
The product is available in standard configurations with optional fixtures and software functions to support different materials, pressure ranges, and testing requirements.
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