Clean Oxygen-Free Oven
The Clean Oxygen-Free Oven is designed for precision baking processes requiring a clean and low-oxygen environment. The equipment adopts hot air circulation, nitrogen inlet/exhaust control, and HEPA filtration technology to provide a stable and controlled thermal processing environment.
The oven is manufactured according to drying oven technical requirements including GB 2423.2-1989 and GB/T 11158-1988. It is widely used in LCD, CMOS IC, electronic components, medical laboratories, and other industries requiring strict control of temperature, cleanliness, and oxidation.
Applications
The Clean Oxygen-Free Oven is suitable for:
LCD and liquid crystal display component processing
CMOS IC and semiconductor component baking
Electronic component aging and thermal treatment
Medical laboratory sample drying
Precision material heat treatment
Oxygen-sensitive material curing and drying
Cleanroom production processes requiring low particle levels
Technical Parameters
| Parameter | Specification |
|---|---|
| Equipment Type | Clean Oxygen-Free Oven |
| Working Chamber Size | W500 × D650 × H500 mm / W600 × D700 × H600 mm / W700 × D900 × H700 mm |
| Cleanliness Level | Class 100 (FED-STD-209E compliant) |
| Particle Control | 0.3 μm particles <300 pcs, 0.5 μm particles <100 pcs |
| Temperature Range | +50℃ to +250℃ |
| Maximum Temperature | 360℃ |
| Temperature Uniformity | ±2℃ (empty chamber test) |
| Temperature Accuracy | ±1℃ (empty chamber test) |
| Heating Method | Clean oxidation-free electric heating system |
| Airflow Direction | Horizontal airflow from left to right |
| Filtration System | Imported HEPA filter |
| Temperature Controller | PID automatic tuning temperature controller |
| Temperature Control Output | SSR solid-state relay power control |
| Temperature Sensor | Armored K-type thermocouple |
| Temperature Monitoring | 6-channel temperature recorder |
| Control System | Touchscreen operation |
| Inner Chamber Material | SUS304 stainless steel |
| External Material | SS441 steel plate with high-temperature coating |
| Insulation Material | 128K high-density insulation board |
| Gas Control | Nitrogen inlet and exhaust system |
| Safety Protection | Emergency stop, over-temperature protection, power failure alarm, phase protection, overload protection, short circuit protection, leakage protection, electromagnetic door interlock |
Features
Clean Oxygen-Free Processing Environment
Nitrogen inlet and exhaust control reduces oxygen concentration and helps prevent oxidation during high-temperature baking.
Class 100 Cleanliness Design
Equipped with HEPA filtration and optimized airflow structure to reduce airborne particles.
High Temperature Stability
Supports operating temperatures up to 250℃ with a maximum temperature of 360℃ for special processes.
Precision Temperature Control
PID control with SSR output provides accurate temperature regulation and stable operation.
Uniform Airflow System
Horizontal airflow design ensures balanced air distribution and improved temperature uniformity.
SUS304 Stainless Steel Chamber
Fully welded stainless steel inner chamber reduces contamination and prevents particle generation.
Energy-Saving Insulation Structure
High-density 128K insulation material minimizes heat loss and improves energy efficiency.
Advanced Temperature Monitoring
Six-channel temperature recorder provides real-time monitoring and process documentation.
Intelligent Control System
Touchscreen operation simplifies parameter setting and equipment management.
Complete Safety Protection
Multiple protection functions ensure safe and reliable operation during production.
Leave Message Get Price
